CMXSH-3

30V Surface mount Diode-Schottky (<1A) Triple

Case Type: SOT-26

Continuous Forward Current (IF)
100 mA
Forward Voltage (VF)
330 mV

(290 mV Typical)

Forward Voltage (VF)
450 mV

(370 mV Typical)

Forward Voltage (VF)
1 V

(0.51 V Typical)

Junction Capacitance (CJ)
7 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
750 mA
Peak Repetitive Forward Current (IFRM)
350 mA
Peak Repetitive Reverse Voltage (VRRM)
30 V
Power Dissipation (PD)
350 mW
Reverse Breakdown Voltage (BVR)
30 V
Reverse Recovery Time (trr)
5 ns
Reverse Voltage Leakage Current (IR)
500 nA

(90 nA Typical)

Reverse Voltage Leakage Current (IR)
100 µA

(25 µA Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMXSH-3 BK Box@3,500 Active 30V Surface mount Diode-Schottky (<1A) Triple EAR99 8541.10.0070 PBFREE

Resources

Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
CMXSH-3.PDF Device Datasheet
Material Composition:SOT-26 Material Composition
Package Detail Document:SOT-26 Package Detail Document
Process Change Notice:SOT-26 CASE Process Change Notice
Product Reliability Data:SOT-26 Package Reliability Product Reliability Data
Spice Model:Spice Model CMXSH-3 Spice Model
Step File 3D Object:SOT-26 Step File 3D Object

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development