CTLSH01-30L
100mA,30V Surface mount Diode-Schottky (<1A) Single
Case Type: TLM2D3D6
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 5 µA
(70 mV Typical)
Test Conditions
IF = 10 mA
(300 mV Typical)
Test Conditions
f = 1 MHz
Test Conditions
IR = 100 µA
Test Conditions
VR = 3.3 V
(0.8 µA Typical)
Test Conditions
VR = 10 V
(1.3 µA Typical)
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CTLSH01-30L BK | Box@5,000 | Active | 100mA,30V Surface mount Diode-Schottky (<1A) Single | EAR99 | 8541.10.0070 | PBFREE | |
CTLSH01-30L TR | Tape & Reel@8,000 | Active | 100mA,30V Surface mount Diode-Schottky (<1A) Single | EAR99 | 8541.10.0070 | TIN |
Resources
Item | Type |
---|---|
No matching documents found. | |
Analytical Test Report:Die Attach | Analytical Test Report |
Analytical Test Report:Gold Bond Wire | Analytical Test Report |
Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Leadframe | Analytical Test Report |
CTLSH01-30L.PDF | Device Datasheet |
Material Composition:TLM2D3D6 | Material Composition |
Package Detail Document:TLM2D3D6 | Package Detail Document |
Product Reliability Data:TLM2D3D6 Package Reliability | Product Reliability Data |
Spice Model:Spice Model CTLSH01-30L | Spice Model |
Product Support
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- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportWe provide the highest level of support to insure product is delivered on-time:
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- Custom electrical curves
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development