CTLSH15-60M364

15A,60V Surface mount Rectifier-Schottky (>=1A) Single: Low VF

Case Type: TLM364

Average Forward Current (IO)
15 A
Continuous Reverse Voltage (VR)
60 V
Forward Voltage (VF)
590 mV

(540 mV Typical)

Junction Capacitance (CJ)
550 pF
Junction Temperature (Tj)
-55 — 150 °C
Peak Forward Surge Current (IFSM)
250 A
Peak Repetitive Reverse Voltage (VRRM)
60 V
Reverse Breakdown Voltage (BVR)
60 V
Reverse Voltage Leakage Current (IR)
200 µA

(60 µA Typical)

Reverse Voltage Leakage Current (IR)
50 mA

(15 mA Typical)

RMS Reverse Voltage (VR(RMS))
42 V
Storage Temperature (Tstg)
-55 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
110 °C/W
Thermal Resistance Junction-Lead (ΘJL)
6 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CTLSH15-60M364 BK Box@5,000 Active 15A,60V Surface mount Rectifier-Schottky (>=1A) Single: Low VF EAR99 8541.10.0080 PBFREE
CTLSH15-60M364 TR13 Tape & Reel@5,000 Active 15A,60V Surface mount Rectifier-Schottky (>=1A) Single: Low VF EAR99 8541.10.0080 TIN

Resources

Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:High Temp Solder Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CTLSH15-60M364.PDF Device Datasheet
Material Composition:TLM364 Material Composition
Package Detail Document:TLM364 Package Detail Document
Spice Model:Spice Model CTLSH15-60M364 Spice Model

We provide the highest level of support to insure product is delivered on-time:

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development