1N3595

Through-Hole Diode-Switching Single

Case Type: DO-35

Average Forward Current (IO)
150 mA
Continuous Forward Current (IF)
225 mA
Continuous Reverse Voltage (VR)
125 V
Forward Voltage (VF)
540 — 690 mV
Forward Voltage (VF)
620 — 770 mV
Forward Voltage (VF)
650 — 800 mV
Forward Voltage (VF)
750 — 880 mV
Forward Voltage (VF)
790 — 920 mV
Forward Voltage (VF)
0.83 — 1 V
Junction Capacitance (CJ)
8 pF
Junction Temperature (Tj)
-65 — 200 °C
Peak Forward Surge Current (IFSM)
500 mA
Peak Forward Surge Current (IFSM)
4 A
Peak Repetitive Forward Current (IFRM)
600 mA
Peak Repetitive Reverse Voltage (VRRM)
150 V
Power Dissipation (PD)
500 mW
Reverse Breakdown Voltage (BVR)
150 V
Reverse Recovery Time (trr)
3 µs
Reverse Voltage Leakage Current (IR)
1 nA
Reverse Voltage Leakage Current (IR)
500 nA
Reverse Voltage Leakage Current (IR)
3 µA
Reverse Voltage Leakage Current (IR)
300 nA
Storage Temperature (Tstg)
-65 — 200 °C

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
1N3595 BK Box@2,500 Discontinued Through-Hole Diode-Switching Single EAR99 8541.10.0070 PBFREE

Resources

1N3595.PDF Device Datasheet
Analytical Test Report:Glass Encapsulation Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Material Composition:DO-35 Material Composition
Package Detail Document:DO-35 Package Detail Document
Product EOL Notice:CDH333 / 1N3595 Product EOL Notice
Product Reliability Data:DO-35 Package Reliability Product Reliability Data
Spice Model:Spice Model 1N3595 Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development