1N3600

Through-Hole Diode-Switching Single

Case Type: DO-35

Average Forward Current (IO)
200 mA
Continuous Forward Current (IF)
400 mA
Forward Recovery Time (tfr)
10 ns
Forward Voltage (VF)
540 — 620 mV
Forward Voltage (VF)
660 — 740 mV
Forward Voltage (VF)
760 — 860 mV
Forward Voltage (VF)
820 — 920 mV
Forward Voltage (VF)
0.87 — 1 V
Junction Capacitance (CJ)
2.5 pF
Junction Temperature (Tj)
-65 — 200 °C
Peak Forward Surge Current (IFSM)
1 A
Peak Forward Surge Current (IFSM)
4 A
Peak Repetitive Forward Current (IFRM)
600 mA
Peak Repetitive Reverse Voltage (VRRM)
50 V
Power Dissipation (PD)
500 mW
Reverse Breakdown Voltage (BVR)
75 V
Reverse Recovery Time (trr)
4 ns
Reverse Recovery Time (trr)
4 ns
Reverse Recovery Time (trr)
6 ns
Reverse Voltage Leakage Current (IR)
100 nA
Reverse Voltage Leakage Current (IR)
100 µA
Storage Temperature (Tstg)
-65 — 200 °C

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
1N3600 BK Box@2,500 Active Through-Hole Diode-Switching Single EAR99 8541.10.0070 PBFREE
1N3600 TR Tape & Reel@10,000 Active Through-Hole Diode-Switching Single EAR99 8541.10.0070 LEAD or TIN

Resources

1N3600.PDF Device Datasheet
Analytical Test Report:Glass Encapsulation Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Material Composition:DO-35 Material Composition
Package Detail Document:DO-35 Package Detail Document
Product Reliability Data:DO-35 Package Reliability Product Reliability Data
Spice Model:Spice Model 1N3600 Spice Model

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development