1N4148

Through-Hole Diode-Switching Single

Case Type: DO-35

Average Forward Current (IO)
150 mA
Continuous Forward Current (IF)
200 mA
Continuous Reverse Voltage (VR)
75 V
Forward Voltage (VF)
1 V
Junction Capacitance (CJ)
4 pF
Junction Temperature (Tj)
-65 — 200 °C
Peak Forward Surge Current (IFSM)
2 A
Peak Repetitive Reverse Voltage (VRRM)
100 V
Power Dissipation (PD)
500 mW
Reverse Breakdown Voltage (BVR)
75 V
Reverse Breakdown Voltage (BVR)
100 V
Reverse Recovery Time (trr)
4 ns
Reverse Voltage Leakage Current (IR)
25 nA
Storage Temperature (Tstg)
-65 — 200 °C

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
1N4148 BK Box@2,500 Discontinued Through-Hole Diode-Switching Single EAR99 8541.90.0000 PBFREE
1N4148 TR Tape & Reel@10,000 Discontinued Through-Hole Diode-Switching Single EAR99 8541.90.0000 PBFREE
1N4148 TR-RECU Tape & Reel@2,500 Discontinued, Stock Only Through-Hole Diode-Switching Single EAR99 8541.90.0000 PBFREE
1N4148 TR-RPCU Tape & Reel@2,500 Discontinued, Stock Only Through-Hole Diode-Switching Single EAR99 8541.90.0000 PBFREE

Resources

1N4148.PDF Device Datasheet
Analytical Test Report:Glass Encapsulation Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Material Composition:DO-35 Material Composition
Package Detail Document:DO-35 Package Detail Document
Process Change Notice:DO-35 Alternate Marking Process Change Notice
Product EOL Notice:1N4148 Silicon Switching Diode Product EOL Notice
Product Reliability Data:DO-35 Package Reliability Product Reliability Data
Spice Model:Spice Model 1N4148 Spice Model

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development