BAX12

400mA,90V Through-Hole Diode-Switching Single

Case Type: DO-35

Average Forward Current (IO)
400 mA
Continuous Forward Current (IF)
400 mA
Continuous Reverse Voltage (VR)
90 V
Forward Voltage (VF)
750 mV
Forward Voltage (VF)
840 mV
Forward Voltage (VF)
900 mV
Forward Voltage (VF)
1 V
Forward Voltage (VF)
1.25 V
Junction Capacitance (CJ)
35 pF
Junction Temperature (Tj)
-65 — 200 °C
Peak Forward Surge Current (IFSM)
25 A
Peak Forward Surge Current (IFSM)
9 A
Peak Forward Surge Current (IFSM)
2.5 A
Peak Repetitive Forward Current (IFRM)
800 mA
Peak Repetitive Reverse Current (IRRM)
600 mA
Peak Repetitive Reverse Voltage (VRRM)
90 V
Power Dissipation (PD)
450 mW
Reverse Breakdown Voltage (BVR)
120 — 170 V
Reverse Recovery Time (trr)
50 ns
Reverse Voltage Leakage Current (IR)
100 nA
Reverse Voltage Leakage Current (IR)
100 µA
Storage Temperature (Tstg)
-65 — 200 °C
Thermal Resistance Junction-Ambient (ΘJA)
375 °C/W
Thermal Resistance Junction-Lead (ΘJL)
240 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
BAX12 BK Box@2,500 Discontinued 400mA,90V Through-Hole Diode-Switching Single EAR99 8541.10.0070 PBFREE

Resources

Analytical Test Report:Glass Encapsulation Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
BAX12.PDF Device Datasheet
Material Composition:DO-35 Material Composition
Package Detail Document:DO-35 Package Detail Document
Product EOL Notice:BAX12 Product EOL Notice
Product Reliability Data:DO-35 Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development