CDH333

200mA,150V Through-Hole Diode-Switching Single

Case Type: DO-35

Average Forward Current (IO)
200 mA
Continuous Forward Current (IF)
500 mA
Continuous Reverse Voltage (VR)
125 V
Forward Voltage (VF)
800 — 890 mV
Forward Voltage (VF)
830 — 940 mV
Forward Voltage (VF)
0.87 — 1.05 V
Forward Voltage (VF)
0.88 — 1.08 V
Forward Voltage (VF)
0.9 — 1.15 V
Forward Voltage (VF)
860 — 970 mV
Junction Capacitance (CJ)
6 pF
Junction Temperature (Tj)
-65 — 200 °C
Peak Forward Surge Current (IFSM)
1 A
Peak Forward Surge Current (IFSM)
4 A
Peak Repetitive Forward Current (IFRM)
600 mA
Peak Repetitive Reverse Voltage (VRRM)
150 V
Power Dissipation (PD)
500 mW
Reverse Breakdown Voltage (BVR)
150 V
Reverse Recovery Time (trr)
3 µs

(1 µs Typical)

Reverse Voltage Leakage Current (IR)
3 nA
Reverse Voltage Leakage Current (IR)
500 nA
Storage Temperature (Tstg)
-65 — 200 °C

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CDH333 BK Box@2,500 Discontinued 200mA,150V Through-Hole Diode-Switching Single EAR99 8541.10.0070 PBFREE
CDH333 TR Tape & Reel@10,000 Discontinued 200mA,150V Through-Hole Diode-Switching Single EAR99 8541.10.0070 PBFREE

Resources

Analytical Test Report:Glass Encapsulation Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CDH300-333.PDF Device Datasheet
Material Composition:DO-35 Material Composition
Package Detail Document:DO-35 Package Detail Document
Product EOL Notice:CDH333 / 1N3595 Product EOL Notice
Product Reliability Data:DO-35 Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development