CFD6001P

Surface mount Diode-Ultra Low Leakage Dual

Case Type: SOD-882L

Continuous Forward Current (IF)
250 mA
Forward Voltage (VF)
0.85 V
Forward Voltage (VF)
0.95 V
Forward Voltage (VF)
1.1 V
Junction Capacitance (CJ)
6 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
4 A
Peak Forward Surge Current (IFSM)
1 A
Power Dissipation (PD)
100 mW
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
1250 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CFD6001P BK Box@5,000 Active Surface mount Diode-Ultra Low Leakage Dual EAR99 8541.10.0070 PBFREE
CFD6001P TR Tape & Reel@8,000 Active Surface mount Diode-Ultra Low Leakage Dual EAR99 8541.10.0070 PBFREE

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Ni/Pd/Au plated leadframe Analytical Test Report
CFD6001P.PDF Device Datasheet
Material Composition:SOD-882L Material Composition
Package Detail Document:SOD-882L Package Detail Document
Process Change Notice:CFSH01-30 Process Change Notice
Product Reliability Data:SOD-882L Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development