CMHD3595

150mA,150V Surface mount Diode-Low Leakage Single

Case Type: SOD-123

Average Forward Current (IO)
150 mA
Continuous Forward Current (IF)
225 mA
Forward Voltage (VF)
540 — 690 mV
Forward Voltage (VF)
620 — 770 mV
Forward Voltage (VF)
650 — 800 mV
Forward Voltage (VF)
750 — 880 mV
Forward Voltage (VF)
790 — 920 mV
Forward Voltage (VF)
0.83 — 1 V
Junction Capacitance (CJ)
8 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
500 mA
Peak Forward Surge Current (IFSM)
4 A
Peak Repetitive Forward Current (IFRM)
600 mA
Peak Repetitive Reverse Voltage (VRRM)
150 V
Peak Working Reverse Voltage (VRWM)
125 V
Power Dissipation (PD)
400 mW
Reverse Breakdown Voltage (BVR)
150 V
Reverse Recovery Time (trr)
3 µs
Reverse Voltage Leakage Current (IR)
1 nA
Reverse Voltage Leakage Current (IR)
2 µA
Reverse Voltage Leakage Current (IR)
5 µA
Reverse Voltage Leakage Current (IR)
300 nA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
312.5 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMHD3595 BK Box@3,500 Active 150mA,150V Surface mount Diode-Low Leakage Single EAR99 8541.10.0070 PBFREE
CMHD3595 TR Tape & Reel@3,000 Active 150mA,150V Surface mount Diode-Low Leakage Single EAR99 8541.10.0070 TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
CMHD3595.PDF Device Datasheet
Material Composition:SOD-123 Material Composition
Package Detail Document:SOD-123 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Process Change Notice:CPD64 REPLACED WITH CPD66X Process Change Notice
Process Change Notice:CPD66X DOPANT CHANGE Process Change Notice
Product Reliability Data:SOD-123 Package Reliability Product Reliability Data
Spice Model:Spice Model CMHD3595 Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
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  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development