CMKD7000

200mA,100V Surface mount Diode-Switching Dual Pair: In Series

Case Type: SOT-363

Average Forward Current (IO)
200 mA
Forward Voltage (VF)
550 — 700 mV
Forward Voltage (VF)
670 — 820 mV
Forward Voltage (VF)
0.75 — 1.1 V
Junction Capacitance (CJ)
2.6 pF

(1.5 pF Typical)

Junction Temperature (Tj)
-65 — 150 °C
Peak Repetitive Forward Current (IFRM)
500 mA
Peak Repetitive Reverse Voltage (VRRM)
100 V
Power Dissipation (PD)
250 mW
Reverse Breakdown Voltage (BVR)
100 V
Reverse Recovery Time (trr)
4 ns

(2 ns Typical)

Reverse Voltage Leakage Current (IR)
300 nA
Reverse Voltage Leakage Current (IR)
100 µA
Reverse Voltage Leakage Current (IR)
500 nA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
500 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMKD7000 BK Box@5,000 Active 200mA,100V Surface mount Diode-Switching Dual Pair: In Series EAR99 8541.10.0070 PBFREE
CMKD7000 TR Tape & Reel@3,000 Active 200mA,100V Surface mount Diode-Switching Dual Pair: In Series EAR99 8541.10.0070 TIN

Resources

Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMKD7000.PDF Device Datasheet
Material Composition:SOT-363 Material Composition
Package Detail Document:SOT-363 Package Detail Document
Product Reliability Data:SOT-363 Package Reliability Product Reliability Data
Spice Model:Spice Model CMKD7000 Spice Model
Step File 3D Object:SOT-363 (SC-88) Step File 3D Object

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
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  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development