CMLD3003DO

200mA Surface mount Diode-Low Leakage Dual: Opposing Polarity

Case Type: SOT-563

Average Forward Current (IO)
200 mA
Continuous Forward Current (IF)
600 mA
Continuous Reverse Voltage (VR)
180 V
Forward Voltage (VF)
620 — 720 mV
Forward Voltage (VF)
720 — 830 mV
Forward Voltage (VF)
800 — 890 mV
Forward Voltage (VF)
830 — 930 mV
Forward Voltage (VF)
0.87 — 1.1 V
Forward Voltage (VF)
0.9 — 1.15 V
Junction Capacitance (CJ)
4 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
2 A
Peak Forward Surge Current (IFSM)
1 A
Peak Repetitive Forward Current (IFRM)
700 mA
Power Dissipation (PD)
250 mW
Reverse Breakdown Voltage (BVR)
200 V
Reverse Voltage Leakage Current (IR)
1 nA
Reverse Voltage Leakage Current (IR)
3 µA
Reverse Voltage Leakage Current (IR)
10 nA
Reverse Voltage Leakage Current (IR)
5 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
500 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMLD3003DOG BK Box@5,000 Active 200mA Surface mount Diode-Low Leakage Dual: Opposing Polarity EAR99 8541.10.0070 PBFREE
CMLD3003DOG TR Tape & Reel@3,000 Active 200mA Surface mount Diode-Low Leakage Dual: Opposing Polarity EAR99 8541.10.0070 TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMLD3003DO.PDF Device Datasheet
Material Composition:SOT-563 Material Composition
Package Detail Document:SOT-563 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-563 Process Change Notice
Process Change Notice:CPD64 REPLACED WITH CPD66X Process Change Notice
Process Change Notice:CPD66X DOPANT CHANGE Process Change Notice
Process Change Notice:SOT-563 Alternate Lead Frame Process Change Notice
Product Reliability Data:SOT-563 Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development