CMLD4448DO

120V Surface mount Diode-Switching Dual: Opposing Polarity

Case Type: SOT-563

Continuous Forward Current (IF)
250 mA
Forward Voltage (VF)
550 — 650 mV

(590 mV Typical)

Forward Voltage (VF)
670 — 770 mV

(720 mV Typical)

Forward Voltage (VF)
0.85 — 1 V

(0.91 V Typical)

Junction Capacitance (CJ)
1.5 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
4 A
Peak Forward Surge Current (IFSM)
1 A
Peak Repetitive Forward Current (IFRM)
500 mA
Peak Repetitive Reverse Voltage (VRRM)
120 V
Power Dissipation (PD)
250 mW
Reverse Breakdown Voltage (BVR)
120 V

(150 V Typical)

Reverse Recovery Time (trr)
4 ns

(2 ns Typical)

Reverse Voltage Leakage Current (IR)
300 nA
Reverse Voltage Leakage Current (IR)
100 µA
Reverse Voltage Leakage Current (IR)
500 nA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
500 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMLD4448DO BK Box@5,000 Active 120V Surface mount Diode-Switching Dual: Opposing Polarity EAR99 8541.10.0070 PBFREE
CMLD4448DOG BK Box@5,000 Active 120V Surface mount Diode-Switching Dual: Opposing Polarity EAR99 8541.10.0070 PBFREE
CMLD4448DOG TR Tape & Reel@3,000 Active 120V Surface mount Diode-Switching Dual: Opposing Polarity EAR99 8541.10.0070 TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMLD4448DO.PDF Device Datasheet
Material Composition:SOT-563 Material Composition
Package Detail Document:SOT-563 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-563 Process Change Notice
Process Change Notice:SOT-563 Alternate Lead Frame Process Change Notice
Product Reliability Data:SOT-563 Package Reliability Product Reliability Data
Spice Model:CMLD4448DOG Spice Model

We provide the highest level of support to insure product is delivered on-time:

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development