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CMOD4448

250mA,100V Surface mount Diode-Switching Single

Case Type: SOD-523

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Technical Specifications

Similar Products with Selected Specifications
Average Forward Current (IO)
250 mA
Continuous Reverse Voltage (VR)
75 V
Forward Voltage (VF)
620 — 720 mV
Forward Voltage (VF)
1 V
Junction Capacitance (CJ)
4 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
4 A
Peak Forward Surge Current (IFSM)
1 A
Peak Repetitive Forward Current (IFRM)
500 mA
Peak Repetitive Reverse Voltage (VRRM)
100 V
Power Dissipation (PD)
250 mW
Reverse Breakdown Voltage (BVR)
75 V
Reverse Breakdown Voltage (BVR)
100 V
Reverse Recovery Time (trr)
4 ns
Reverse Voltage Leakage Current (IR)
25 nA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
500 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMOD4448 BK Box@5,000 Active 250mA,100V Surface mount Diode-Switching Single EAR99 8541.10.0070 TIN

Resources

Item Type
Analytical Test Report:Alloy 42 leadframe Analytical Test Report
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMOD4448.PDF Device Datasheet
Material Composition:SOD-523 Material Composition
Package Detail Document:SOD-523 Package Detail Document
Process Change Notice:CMDD4448/CMOD4448 Process Change Notice
Process Change Notice:Copper Wire Bonding - SOD-523 Process Change Notice
Product Reliability Data:SOD-523 Package Reliability Product Reliability Data
Spice Model:Spice Model CMOD4448 Spice Model

Product Support

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Design Support

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  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development