CMPD2838

200mA,75V Surface mount Diode-Switching Dual: Common Cathode

Case Type: SOT-23

Average Forward Current (IO)
200 mA
Forward Voltage (VF)
1 V
Forward Voltage (VF)
1 V
Forward Voltage (VF)
1.2 V
Junction Capacitance (CJ)
4 pF

(1.5 pF Typical)

Junction Temperature (Tj)
-65 — 150 °C
Peak Repetitive Forward Current (IFRM)
300 mA
Peak Repetitive Reverse Voltage (VRRM)
75 V
Power Dissipation (PD)
350 mW
Reverse Breakdown Voltage (BVR)
75 V
Reverse Recovery Time (trr)
4 ns
Reverse Voltage Leakage Current (IR)
100 nA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMPD2838 BK Box@3,500 Active 200mA,75V Surface mount Diode-Switching Dual: Common Cathode EAR99 8541.10.0070 TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMPD2836&38.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Switching, Schottky and Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:Spice Model CMPD2838 Spice Model
Step File 3D Object:SOT-23 Step File 3D Object

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development