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CMPD3003

200mA,200V Surface mount Diode-Low Leakage Single

Case Type: SOT-23

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Technical Specifications

Similar Products with Selected Specifications
Average Forward Current (IO)
200 mA
Continuous Forward Current (IF)
600 mA
Continuous Reverse Voltage (VR)
180 V
Forward Voltage (VF)
620 — 720 mV
Forward Voltage (VF)
720 — 830 mV
Forward Voltage (VF)
800 — 890 mV
Forward Voltage (VF)
830 — 930 mV
Forward Voltage (VF)
0.87 — 1.1 V
Forward Voltage (VF)
0.9 — 1.15 V
Junction Capacitance (CJ)
4 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
2 A
Peak Forward Surge Current (IFSM)
1 A
Peak Repetitive Forward Current (IFRM)
700 mA
Peak Repetitive Reverse Voltage (VRRM)
200 V
Power Dissipation (PD)
350 mW
Reverse Breakdown Voltage (BVR)
200 V
Reverse Voltage Leakage Current (IR)
1 nA
Reverse Voltage Leakage Current (IR)
3 µA
Reverse Voltage Leakage Current (IR)
10 nA
Reverse Voltage Leakage Current (IR)
5 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMPD3003 BK Box@3,500 Active 200mA,200V Surface mount Diode-Low Leakage Single EAR99 8541.10.0070 TIN
CMPD3003 TR Tape & Reel@3,000 Active 200mA,200V Surface mount Diode-Low Leakage Single EAR99 8541.10.0070 TIN

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMPD3003-A-C-S.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Switching, Schottky and Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Process Change Notice:CPD64 REPLACED WITH CPD66X Process Change Notice
Process Change Notice:CPD66X DOPANT CHANGE Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:CMPD3003 Spice Model
Spice Model:I-Spice Model CMPD3003 Spice Model
Spice Model:P-Spice Model CMPD3003 Spice Model
Step File 3D Object:SOT-23 Step File 3D Object

Product Support

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Design Support

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  • SPICE models
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  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development