CMPD3003C
200mA,200V Surface mount Diode-Low Leakage Dual: Common Cathode
Case Type: SOT-23
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 1 mA
Test Conditions
IF = 10 mA
Test Conditions
IF = 50 mA
Test Conditions
IF = 100 mA
Test Conditions
IF = 200 mA
Test Conditions
IF = 300 mA
Test Conditions
f = 1 MHz
Test Conditions
IR = 5 µA
Test Conditions
VR = 125 V
Test Conditions
VR = 125 V
TA = 150 °C
Test Conditions
VR = 180 V
Test Conditions
VR = 180 V
TA = 150 °C
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMPD3003C BK | Box@3,500 | Active | 200mA,200V Surface mount Diode-Low Leakage Dual: Common Cathode | EAR99 | 8541.10.0070 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| CMPD3003-A-C-S.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Switching, Schottky and | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CPD64 REPLACED WITH CPD66X | Process Change Notice |
| Process Change Notice:CPD66X DOPANT CHANGE | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:I-Spice Model CMPD3003C | Spice Model |
| Spice Model:P-Spice Model CMPD3003C | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |
Product Support
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- Supply management (Customer portals)
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- Consolidated shipping options
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Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development