CMPD6001A

100V Surface mount Diode-Ultra Low Leakage Dual: Common Anode

Case Type: SOT-23

Continuous Forward Current (I_F)

250 mA

Continuous Reverse Voltage (V_R)

75 V

Forward Voltage (V_F)

850 mV

Forward Voltage (V_F)

950 mV

Forward Voltage (V_F)

1.1 V

Junction Capacitance (C_J)

2 pF

Junction Temperature (T_j)

-65 — 150 °C

Peak Forward Surge Current (I_FSM)

4 A

Peak Forward Surge Current (I_FSM)

1 A

Peak Repetitive Forward Current (I_FRM)

250 mA

Peak Repetitive Reverse Voltage (V_RRM)

100 V

Power Dissipation (P_D)

350 mW

Reverse Breakdown Voltage (B_VR)

100 V

Reverse Recovery Time (t_rr)

3 µs

Reverse Voltage Leakage Current (I_R)

500 pA

Storage Temperature (T_stg)

-65 — 150 °C

Thermal Resistance Junction-Ambient (Θ_JA)

357 °C/W

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CMPD6001A BK	Box@3,500		Active	100V Surface mount Diode-Ultra Low Leakage Dual: Common Anode	EAR99	8541.10.0070	TIN


Item	Type
No matching documents found.
Analytical Test Report:Copper Bond Wire	Analytical Test Report
Analytical Test Report:Gold Bond Wire	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4	Analytical Test Report
Analytical Test Report:Leadframe	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
CMPD6001-A-C-S_R1.PDF	Device Datasheet
Material Composition:SOT-23	Material Composition
Package Detail Document:SOT-23	Package Detail Document
Process Change Notice:All Switching, Schottky and	Process Change Notice
Process Change Notice:Copper Wire Bonding	Process Change Notice
Product Reliability Data:SOT-23 Package Reliability	Product Reliability Data
Spice Model:I-Spice Model CMPD6001A	Spice Model
Spice Model:P-Spice Model CMPD6001A	Spice Model
Step File 3D Object:SOT-23	Step File 3D Object