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CMSD6001S

100V Surface mount Diode-Ultra Low Leakage Dual: In Series

Case Type: SOT-323

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Technical Specifications

Similar Products with Selected Specifications
Continuous Forward Current (IF)
250 mA
Continuous Reverse Voltage (VR)
75 V
Forward Voltage (VF)
850 mV
Forward Voltage (VF)
950 mV
Forward Voltage (VF)
1.1 V
Junction Capacitance (CJ)
2 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
4 A
Peak Forward Surge Current (IFSM)
1 A
Peak Repetitive Forward Current (IFRM)
250 mA
Peak Repetitive Reverse Voltage (VRRM)
100 V
Power Dissipation (PD)
275 mW
Reverse Breakdown Voltage (BVR)
100 V
Reverse Recovery Time (trr)
3 µs
Reverse Voltage Leakage Current (IR)
500 pA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
455 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMSD6001S BK Box@5,000 Active 100V Surface mount Diode-Ultra Low Leakage Dual: In Series EAR99 8541.10.0070 PBFREE
CMSD6001S TR Tape & Reel@3,000 Active 100V Surface mount Diode-Ultra Low Leakage Dual: In Series EAR99 8541.10.0070 TIN

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMSD6001_SERIES.PDF Device Datasheet
Material Composition:SOT-323 Material Composition
Package Detail Document:SOT-323 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-323 Package Reliability Product Reliability Data
Step File 3D Object:SOT-323 (SC-70) Step File 3D Object

Product Support

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Design Support

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  • Application notes
  • Application and design sample kits
  • Custom product and package development