CMUD2836

200mA,75V Surface mount Diode-Switching Dual: Common Anode

Case Type: SOT-523

Average Forward Current (IO)
200 mA
Forward Voltage (VF)
1 V
Forward Voltage (VF)
1 V
Forward Voltage (VF)
1.2 V
Junction Capacitance (CJ)
4 pF

(1.5 pF Typical)

Junction Temperature (Tj)
-65 — 150 °C
Peak Repetitive Forward Current (IFRM)
300 mA
Peak Repetitive Reverse Voltage (VRRM)
75 V
Power Dissipation (PD)
250 mW
Reverse Breakdown Voltage (BVR)
75 V
Reverse Recovery Time (trr)
4 ns
Reverse Voltage Leakage Current (IR)
100 nA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
500 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMUD2836 BK Box@5,000 Discontinued 200mA,75V Surface mount Diode-Switching Dual: Common Anode EAR99 8541.10.0070 PBFREE
CMUD2836 TR Tape & Reel@3,000 Discontinued 200mA,75V Surface mount Diode-Switching Dual: Common Anode EAR99 8541.10.0070 PBFREE

Resources

Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMUD2836.PDF Device Datasheet
Material Composition:SOT-523 Material Composition
Package Detail Document:SOT-523 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-523 Process Change Notice
Product EOL Notice:CMUD2836 Product EOL Notice
Product Reliability Data:SOT-523 Package Reliability Product Reliability Data
Spice Model:Spice Model CMUD2836 Spice Model
Step File 3D Object:SOT-523 (SC-89) Step File 3D Object

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development