CMUDW6001

250mA,100V Surface mount Diode-Ultra Low Leakage Single

Case Type: SOT-523W

Average Forward Current (IO)
250 mA
Continuous Reverse Voltage (VR)
75 V
Forward Voltage (VF)
850 mV

(760 mV Typical)

Forward Voltage (VF)
950 mV

(850 mV Typical)

Forward Voltage (VF)
1.1 V

(0.99 V Typical)

Junction Capacitance (CJ)
2 pF

(1.7 pF Typical)

Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
4 A
Peak Forward Surge Current (IFSM)
1 A
Peak Repetitive Forward Current (IFRM)
250 mA
Peak Repetitive Reverse Voltage (VRRM)
100 V
Power Dissipation (PD)
250 mW
Reverse Breakdown Voltage (BVR)
100 V

(125 V Typical)

Reverse Recovery Time (trr)
3 µs
Reverse Voltage Leakage Current (IR)
500 pA

(250 pA Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
500 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMUDW6001 TR Tape & Reel@3,000 Discontinued 250mA,100V Surface mount Diode-Ultra Low Leakage Single EAR99 8541.10.0070 PBFREE

Resources

Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
CMUDW6001.PDF Device Datasheet
Material Composition:SOT-523W Material Composition
Package Detail Document:SOT-523W Package Detail Document
Product Brief:PB CMUDW6001 Product Brief
Product EOL Notice:CMUDW6001 Product EOL Notice
Spice Model:Spice Model CMUDW6001 Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development