CDM22010-650
10A,650V Through-Hole MOSFET N-Channel Enhancement Mode High Current
Case Type: TO-220
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IS = 10 A
di/dt = 100 A/µs
Test Conditions
IS = 10 A
di/dt = 100 A/µs
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
IS = 10 A
(0.9 V Typical)
Test Conditions
ID = 250 µA
Test Conditions
ID(on) = 10 A
VDD = 325 V
RG = 25 Ω
Test Conditions
VGS = 30 V
(10 nA Typical)
Test Conditions
VGS = 30 V
(10 nA Typical)
Test Conditions
ID = 250 µA
(2.8 V Typical)
Test Conditions
VDS = 520 V
VGS = 10 V
ID = 10 A
Test Conditions
VDS = 520 V
VGS = 10 V
ID = 10 A
Test Conditions
ID(on) = 10 A
VDD = 325 V
RG = 25 Ω
Test Conditions
VDS = 650 V
(0.03 µA Typical)
Test Conditions
VGS = 10 V
ID = 5 A
(0.88 Ω Typical)
Test Conditions
ID(on) = 10 A
VDD = 325 V
RG = 25 Ω
Test Conditions
VDS = 520 V
VGS = 10 V
ID = 10 A
Test Conditions
VDD = 325 V
ID(on) = 10 A
RG = 25 Ω
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CDM22010-650 SL | Sleeve@50 | Discontinued | 10A,650V Through-Hole MOSFET N-Channel Enhancement Mode High Current | EAR99 | 8541.29.0095 | PBFREE |
Resources
Item | Type |
---|---|
No matching documents found. | |
Analytical Test Report:Die Attach | Analytical Test Report |
Analytical Test Report:Leadframe | Analytical Test Report |
Analytical Test Report:Sn Plating | Analytical Test Report |
Analytical Test Report:Tin Plating | Analytical Test Report |
CDM22010-650.PDF | Device Datasheet |
Material Composition:TO-220 | Material Composition |
Package Detail Document:TO-220 | Package Detail Document |
Product EOL Notice:TO-220 Series | Product EOL Notice |
Product Reliability Data:TO-220 Package Reliability | Product Reliability Data |
Spice Model:Spice Model CDM22010-650 | Spice Model |
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Design Support
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- Custom electrical curves
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- Special wafer diffusions
- Custom electrical curves
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development