Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
IS = 350 mA
Test Conditions
IS = 350 mA
Test Conditions
ID = 250 µA
Test Conditions
ID = 250 µA
Test Conditions
VGS = 4.5 V
Test Conditions
VGS = 4.5 V
Test Conditions
VGS = 4.5 V
Test Conditions
VGS = 4.5 V
Test Conditions
ID = 250 µA
Test Conditions
ID = 250 µA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 500 mA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 200 mA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 500 mA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 200 mA
Test Conditions
VDS = 16 V
Test Conditions
VDS = 16 V
Test Conditions
VGS = 4.5 V
ID = 540 mA
(350 mΩ Typical)
Test Conditions
VGS = 2.5 V
ID = 500 mA
(500 mΩ Typical)
Test Conditions
VGS = 1.8 V
ID = 350 mA
(700 mΩ Typical)
Test Conditions
VGS = 4.5 V
ID = 430 mA
(400 mΩ Typical)
Test Conditions
VGS = 2.5 V
ID = 300 mA
(0.55 Ω Typical)
Test Conditions
VGS = 1.8 V
ID = 150 mA
(0.75 Ω Typical)
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 500 mA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 200 mA
Test Conditions
VDD = 10 V
ID = 540 mA
RG = 10 Ω
VGS = 4.5 V
Test Conditions
VDD = 10 V
ID = 215 mA
RG = 10 Ω
VGS = 4.5 V
Test Conditions
VDD = 10 V
RG = 10 Ω
ID = 540 mA
VGS = 4.5 V
Test Conditions
VDD = 10 V
RG = 10 Ω
ID = 215 mA
VGS = 4.5 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMLDM3757 BK | Box@5,000 | Active | Surface mount MOSFET Dual: N-Channel/P-Channel MOSFET | EAR99 | 8541.21.0095 | PBFREE | |
| CMLDM3757 TR | Tape & Reel@3,000 | Active | Surface mount MOSFET Dual: N-Channel/P-Channel MOSFET | EAR99 | 8541.21.0095 | TIN |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMLDM3757.PDF | Device Datasheet |
| Material Composition:SOT-563 | Material Composition |
| Package Detail Document:SOT-563 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-563 | Process Change Notice |
| Process Change Notice:SOT-563 Alternate Lead Frame | Process Change Notice |
| Product Reliability Data:SOT-563 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMLDM3757_NCHAN | Spice Model |
| Spice Model:Spice Model CMLDM3757_PCHAN | Spice Model |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development