CMLDM5757

430mA,20V Surface mount MOSFET Dual P-Channel Enhancement Mode

Case Type: SOT-563

Common Source Input Capacitance (Ciss)
175 pF
Common Source Output Capacitance (Coss)
30 pF
Common Source Reverse Transfer Capacitance (Crss)
20 pF
Continuous Drain Current (ID)
430 mA
Diode Forward On Voltage (VSD)
1.2 V
Drain-Source Breakdown Voltage (BVDSS)
20 V
Drain-Source Voltage (VDS)
20 V
Gate Leakage Current, Forward (IGSSF)
2 µA
Gate Leakage Current, Reverse (IGSSR)
2 µA
Gate Threshold Voltage (VGS(th))
0.45 — 1 V
Gate-Drain Charge (Qgd)
0.36 nC
Gate-Source Charge (Qgs)
0.24 nC
Gate-Source Voltage (VGS)
8 V
Junction Temperature (Tj)
-65 — 150 °C
Maximum Pulsed Drain Current (IDM)
750 mA
Power Dissipation (PD)
350 mW
Power Dissipation (PD)
300 mW
Power Dissipation (PD)
150 mW
Saturation Drain Current (IDSS)
1 µA
Static Drain-Source On Resistance (rDS(ON))
900 mΩ
Static Drain-Source On Resistance (rDS(ON))
1.2 Ω
Static Drain-Source On Resistance (rDS(ON))
2 Ω
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W
Total Gate Charge (Qg)
1.2 nC
Turn Off Time (toff)
48 ns
Turn On Time (ton)
38 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMLDM5757 BK Box@5,000 Active 430mA,20V Surface mount MOSFET Dual P-Channel Enhancement Mode EAR99 8541.21.0095 PBFREE
CMLDM5757 TR Tape & Reel@3,000 Active 430mA,20V Surface mount MOSFET Dual P-Channel Enhancement Mode EAR99 8541.21.0095 TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMLDM5757.PDF Device Datasheet
Material Composition:SOT-563 Material Composition
Package Detail Document:SOT-563 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-563 Process Change Notice
Process Change Notice:SOT-563 Alternate Lead Frame Process Change Notice
Product Reliability Data:SOT-563 Package Reliability Product Reliability Data
Spice Model:Spice Model CMLDM5757 Spice Model

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
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  • Customer specific screening
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  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development