CMLDM7002A

280mA,60V Surface mount MOSFET Dual N-Channel Enhancement Mode

Case Type: SOT-563

Common Source Input Capacitance (Ciss)
50 pF
Common Source Output Capacitance (Coss)
25 pF
Common Source Reverse Transfer Capacitance (Crss)
5 pF
Continuous Drain Current (ID)
280 mA
Continuous Source Current (Body Diode) (IS)
280 mA
Diode Forward On Voltage (VSD)
1.2 V
Drain-Gate Voltage (VDG)
60 V
Drain-Source Breakdown Voltage (BVDSS)
60 V
Drain-Source On Voltage (VDS(ON))
1 V
Drain-Source On Voltage (VDS(ON))
150 mV
Drain-Source Voltage (VDS)
60 V
Forward Transconductance (gFS)
80 mS
Gate Leakage Current, Forward (IGSSF)
100 nA
Gate Leakage Current, Reverse (IGSSR)
100 nA
Gate Threshold Voltage (VGS(th))
1 — 2.5 V
Gate-Drain Charge (Qgd)
0.148 nC
Gate-Source Charge (Qgs)
0.196 nC
Gate-Source Voltage (VGS)
40 V
Junction Temperature (Tj)
-65 — 150 °C
Maximum Pulsed Drain Current (IDM)
1.5 A
Maximum Pulsed Source Current (ISM)
1.5 A
On State Drain Current (ID(ON))
500 mA
Power Dissipation (PD)
350 mW
Power Dissipation (PD)
300 mW
Power Dissipation (PD)
150 mW
Saturation Drain Current (IDSS)
1 µA
Saturation Drain Current (IDSS)
500 µA
Static Drain-Source On Resistance (rDS(ON))
2 Ω
Static Drain-Source On Resistance (rDS(ON))
3.5 Ω
Static Drain-Source On Resistance (rDS(ON))
3 Ω
Static Drain-Source On Resistance (rDS(ON))
5 Ω
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W
Total Gate Charge (Qg)
0.592 nC
Turn Off Time (toff)
20 ns
Turn On Time (ton)
20 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMLDM7002AG BK Box@5,000 Active 280mA,60V Surface mount MOSFET Dual N-Channel Enhancement Mode EAR99 8541.21.0095 PBFREE
CMLDM7002AG TR Tape & Reel@3,000 Active 280mA,60V Surface mount MOSFET Dual N-Channel Enhancement Mode EAR99 8541.21.0095 TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMLDM7002A.PDF Device Datasheet
Material Composition:SOT-563 Material Composition
Package Detail Document:SOT-563 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-563 Process Change Notice
Process Change Notice:SMD MOSFET Halogen Free Mold Process Change Notice
Process Change Notice:SOT-563 Alternate Lead Frame Process Change Notice
Product Reliability Data:SOT-563 Package Reliability Product Reliability Data
Spice Model:Spice Model CMLDM7002A Spice Model

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We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development