CMLDM7002AJ
280mA,60V Surface mount MOSFET Dual N-Channel Enhancement Mode
Case Type: SOT-563
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
IS = 400 mA
Test Conditions
ID = 10 µA
Test Conditions
ID = 500 mA
VGS = 10 V
Test Conditions
ID = 50 mA
VGS = 5 V
Test Conditions
VDS = 10 V
ID = 200 mA
Test Conditions
VGS = 20 V
Test Conditions
VGS = 20 V
Test Conditions
ID = 250 µA
Test Conditions
VDS = 30 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDS = 30 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDS = 10 V
VGS = 10 V
Test Conditions
VDS = 60 V
Test Conditions
VDS = 60 V
TJ = 125 °C
Test Conditions
VGS = 10 V
ID = 500 mA
Test Conditions
VGS = 10 V
ID = 500 mA
TJ = 125 °C
Test Conditions
VGS = 5 V
ID = 50 mA
Test Conditions
VGS = 5 V
ID = 50 mA
TJ = 125 °C
Test Conditions
VDS = 30 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDD = 30 V
ID = 200 mA
RG = 25 Ω
RL = 150 Ω
VGS = 10 V
Test Conditions
VDD = 30 V
RL = 150 Ω
RG = 25 Ω
ID = 200 mA
VGS = 10 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMLDM7002AJ BK | Box@5,000 | Active | 280mA,60V Surface mount MOSFET Dual N-Channel Enhancement Mode | EAR99 | 8541.21.0095 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMLDM7002A.PDF | Device Datasheet |
| Material Composition:SOT-563 | Material Composition |
| Package Detail Document:SOT-563 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-563 | Process Change Notice |
| Process Change Notice:SOT-563 Alternate Lead Frame | Process Change Notice |
| Product Reliability Data:SOT-563 Package Reliability | Product Reliability Data |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development