CMLDM7005
650mA,20V Surface mount MOSFET Dual N-Channel Enhancement Mode
Case Type: SOT-563
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
IS = 200 mA
Test Conditions
ID = 250 µA
Test Conditions
VDS = 10 V
ID = 400 mA
Test Conditions
VGS = 4.5 V
Test Conditions
VGS = 4.5 V
Test Conditions
ID = 250 µA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 500 mA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 500 mA
Test Conditions
VDS = 16 V
Test Conditions
VGS = 4.5 V
ID = 600 mA
(140 mΩ Typical)
Test Conditions
VGS = 2.5 V
ID = 500 mA
(200 mΩ Typical)
Test Conditions
VGS = 1.8 V
ID = 350 mA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 500 mA
Test Conditions
VDD = 10 V
RG = 10 Ω
ID = 200 mA
VGS = 4.5 V
Test Conditions
VDD = 10 V
RG = 10 Ω
ID = 200 mA
VGS = 4.5 V
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CMLDM7005 BK | Box@5,000 | Active | 650mA,20V Surface mount MOSFET Dual N-Channel Enhancement Mode | EAR99 | 8541.21.0095 | PBFREE | |
CMLDM7005 TR | Tape & Reel@3,000 | Active | 650mA,20V Surface mount MOSFET Dual N-Channel Enhancement Mode | EAR99 | 8541.21.0095 | TIN |
Resources
Item | Type |
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No matching documents found. | |
Analytical Test Report:Copper Bond Wire | Analytical Test Report |
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Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Leadframe | Analytical Test Report |
Analytical Test Report:Sn Plating | Analytical Test Report |
CMLDM7005.PDF | Device Datasheet |
Material Composition:SOT-563 | Material Composition |
Package Detail Document:SOT-563 | Package Detail Document |
Process Change Notice:Copper Wire Bonding - SOT-563 | Process Change Notice |
Process Change Notice:SOT-563 Alternate Lead Frame | Process Change Notice |
Product Reliability Data:SOT-563 Package Reliability | Product Reliability Data |
Spice Model:Spice Model CMLDM7005 | Spice Model |
Product Support
Contact Product SupportWe provide the highest level of support to insure product is delivered on-time:
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportWe provide the highest level of support to insure product is delivered on-time:
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- Custom electrical curves
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development