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CMLDM7120

1A,20V Surface mount MOSFET N-Channel Enhancement Mode

Case Type: SOT-563

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Technical Specifications

Similar Products with Selected Specifications
Common Source Input Capacitance (Ciss)
220 pF
Common Source Output Capacitance (Coss)
120 pF
Common Source Reverse Transfer Capacitance (Crss)
45 pF
Continuous Drain Current (ID)
1 A
Diode Forward On Voltage (VSD)
1.1 V
Drain-Source Breakdown Voltage (BVDSS)
20 V
Drain-Source Voltage (VDS)
20 V
Forward Transconductance (gFS)
2.5 S
Gate Leakage Current, Forward (IGSSF)
10 µA
Gate Leakage Current, Reverse (IGSSR)
10 µA
Gate Threshold Voltage (VGS(th))
0.5 — 1.2 V
Gate-Drain Charge (Qgd)
0.65 nC
Gate-Source Charge (Qgs)
0.25 nC
Gate-Source Voltage (VGS)
8 V
Junction Temperature (Tj)
-65 — 150 °C
Maximum Pulsed Drain Current (IDM)
4 A
Power Dissipation (PD)
350 mW
Power Dissipation (PD)
300 mW
Power Dissipation (PD)
150 mW
Saturation Drain Current (IDSS)
10 µA
Static Drain-Source On Resistance (rDS(ON))
100 mΩ

(75 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
140 mΩ

(100 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
250 mΩ

(200 mΩ Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W
Total Gate Charge (Qg)
2.4 nC
Turn Off Time (toff)
140 ns
Turn On Time (ton)
25 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMLDM7120G BK Box@5,000 Active 1A,20V Surface mount MOSFET N-Channel Enhancement Mode EAR99 8541.21.0095 PBFREE
CMLDM7120G TR Tape & Reel@3,000 Active 1A,20V Surface mount MOSFET N-Channel Enhancement Mode EAR99 8541.21.0095 TIN

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMLDM7120G.PDF Device Datasheet
Material Composition:SOT-563 Material Composition
Package Detail Document:SOT-563 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-563 Process Change Notice
Process Change Notice:SMD MOSFET Halogen Free Mold Process Change Notice
Process Change Notice:SOT-563 Alternate Lead Frame Process Change Notice
Product Reliability Data:SOT-563 Package Reliability Product Reliability Data
Spice Model:Spice Model CMLDM7120 Spice Model

Product Support

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Design Support

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  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development