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CMPDM7002AHC

1A,60V Surface mount MOSFET N-Channel Enhancement Mode

Case Type: SOT-23

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Technical Specifications

Similar Products with Selected Specifications
Common Source Input Capacitance (Ciss)
240 pF
Common Source Output Capacitance (Coss)
50 pF
Common Source Reverse Transfer Capacitance (Crss)
25 pF
Continuous Drain Current (ID)
1 A
Diode Forward On Voltage (VSD)
900 mV
Drain-Gate Voltage (VDG)
60 V
Drain-Source Breakdown Voltage (BVDSS)
63 V
Drain-Source Voltage (VDS)
60 V
Gate Leakage Current, Forward (IGSSF)
10 µA
Gate Leakage Current, Reverse (IGSSR)
10 µA
Gate Threshold Voltage (VGS(th))
1.2 — 2.3 V
Gate-Drain Charge (Qgd)
0.7 nC
Gate-Source Charge (Qgs)
1 nC
Gate-Source Voltage (VGS)
20 V
Junction Temperature (Tj)
-65 — 150 °C
Maximum Pulsed Drain Current (IDM)
5 A
Power Dissipation (PD)
350 mW
Saturation Drain Current (IDSS)
500 nA
Static Drain-Source On Resistance (rDS(ON))
220 mΩ

(150 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
300 mΩ

(200 mΩ Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W
Total Gate Charge (Qg)
2.3 nC
Turn Off Time (toff)
50 ns
Turn On Time (ton)
35 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMPDM7002AHC BK Box@3,500 Active 1A,60V Surface mount MOSFET N-Channel Enhancement Mode EAR99 8541.21.0095 PBFREE
CMPDM7002AHC TR Tape & Reel@3,000 Active 1A,60V Surface mount MOSFET N-Channel Enhancement Mode EAR99 8541.21.0095 TIN

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMPDM7002AHC.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:Spice Model CMPDM7002AHC Spice Model
Step File 3D Object:SOT-23 Step File 3D Object

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Design Support

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  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development