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CMPDM7003

280mA,50V Surface mount MOSFET N-Channel Enhancement Mode

Case Type: SOT-23

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Technical Specifications

Similar Products with Selected Specifications
Common Source Input Capacitance (Ciss)
60 pF
Common Source Output Capacitance (Coss)
25 pF
Common Source Reverse Transfer Capacitance (Crss)
5 pF
Continuous Drain Current (ID)
280 mA
Diode Forward On Voltage (VSD)
1.4 V
Drain-Gate Voltage (VDG)
50 V
Drain-Source Breakdown Voltage (BVDSS)
50 V
Drain-Source Voltage (VDS)
50 V
Forward Transconductance (gFS)
200 mS
Gate Leakage Current, Forward (IGSSF)
100 nA
Gate Leakage Current, Forward (IGSSF)
2 µA
Gate Leakage Current, Forward (IGSSF)
2 µA
Gate Leakage Current, Reverse (IGSSR)
100 nA
Gate Leakage Current, Reverse (IGSSR)
2 µA
Gate Leakage Current, Reverse (IGSSR)
2 µA
Gate Threshold Voltage (VGS(th))
0.49 — 1 V
Gate-Drain Charge (Qgd)
0.156 nC
Gate-Source Charge (Qgs)
0.148 nC
Gate-Source Voltage (VGS)
12 V
Junction Temperature (Tj)
-65 — 150 °C
Maximum Pulsed Drain Current (IDM)
1.5 A
Power Dissipation (PD)
350 mW
Saturation Drain Current (IDSS)
50 nA
Static Drain-Source On Resistance (rDS(ON))
3 Ω

(1.6 Ω Typical)

Static Drain-Source On Resistance (rDS(ON))
2.5 Ω

(1.3 Ω Typical)

Static Drain-Source On Resistance (rDS(ON))
2 Ω

(1.1 Ω Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W
Total Gate Charge (Qg)
0.764 nC

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMPDM7003 TR Tape & Reel@3,000 Active 280mA,50V Surface mount MOSFET N-Channel Enhancement Mode EAR99 8541.21.0095 TIN

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMPDM7003.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:Spice Model CMPDM7003 Spice Model
Step File 3D Object:SOT-23 Step File 3D Object

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Design Support

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