CMUDM7004
450mA,30V Surface mount MOSFET N-Channel Enhancement Mode
Case Type: SOT-523
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 25 V
f = 1 MHz
(43 pF Typical)
Test Conditions
VDS = 25 V
f = 1 MHz
(8 pF Typical)
Test Conditions
VDS = 25 V
f = 1 MHz
(5 pF Typical)
Test Conditions
IS = 400 mA
Test Conditions
ID = 10 µA
Test Conditions
VDS = 10 V
ID = 100 mA
Test Conditions
VGS = 8 V
Test Conditions
VGS = 8 V
Test Conditions
ID = 250 µA
Test Conditions
VDS = 15 V
VGS = 4.5 V
ID = 1 A
Test Conditions
VDS = 15 V
VGS = 4.5 V
ID = 1 A
Test Conditions
VDS = 30 V
Test Conditions
ID = 200 mA
VGS = 4.5 V
(280 mΩ Typical)
Test Conditions
ID = 100 mA
VGS = 2.5 V
(390 mΩ Typical)
Test Conditions
ID = 75 mA
VGS = 1.8 V
(550 mΩ Typical)
Test Conditions
VDS = 15 V
VGS = 4.5 V
ID = 1 A
Test Conditions
VDD = 5 V
ID = 75 mA
RG = 10 Ω
VGS = 4 V
Test Conditions
VDD = 5 V
RG = 10 Ω
ID = 75 mA
VGS = 4 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMUDM7004 BK | Box@5,000 | End Of Life | 450mA,30V Surface mount MOSFET N-Channel Enhancement Mode | EAR99 | 8541.21.0095 | PBFREE | |
| CMUDM7004 TR | Tape & Reel@3,000 | End Of Life | 450mA,30V Surface mount MOSFET N-Channel Enhancement Mode | EAR99 | 8541.21.0095 | TIN |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMUDM7004.PDF | Device Datasheet |
| Material Composition:SOT-523 | Material Composition |
| Package Detail Document:SOT-523 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-523 | Process Change Notice |
| Product EOL Notice:All P/Ns in SOT-523 Case | Product EOL Notice |
| Product Reliability Data:SOT-523 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMUDM7004 | Spice Model |
| Step File 3D Object:SOT-523 (SC-89) | Step File 3D Object |
Product Support
Contact Product SupportWe provide the highest level of support to insure product is delivered on-time:
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportWe provide the highest level of support to insure product is delivered on-time:
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- Custom electrical curves
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development