CTLDM7003-M621
280mA,50V Surface mount MOSFET N-Channel Enhancement Mode
Case Type: TLM621
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
IS = 115 mA
Test Conditions
ID = 10 µA
Test Conditions
VDS = 10 V
ID = 200 mA
Test Conditions
VGS = 5 V
Test Conditions
VGS = 10 V
Test Conditions
VGS = 12 V
Test Conditions
VGS = 5 V
Test Conditions
VGS = 10 V
Test Conditions
VGS = 12 V
Test Conditions
ID = 250 µA
Test Conditions
VDS = 25 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDS = 25 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDS = 50 V
Test Conditions
ID = 50 mA
VGS = 1.8 V
(1.6 Ω Typical)
Test Conditions
ID = 50 mA
VGS = 2.5 V
(1.3 Ω Typical)
Test Conditions
ID = 50 mA
VGS = 5 V
(1.1 Ω Typical)
Test Conditions
VDS = 25 V
VGS = 4.5 V
ID = 100 mA
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CTLDM7003-M621 BK | Box@5,000 | Discontinued | 280mA,50V Surface mount MOSFET N-Channel Enhancement Mode | EAR99 | 8541.21.0095 | PBFREE | |
CTLDM7003-M621 TR | Tape & Reel@3,000 | Discontinued | 280mA,50V Surface mount MOSFET N-Channel Enhancement Mode | EAR99 | 8541.21.0095 | PBFREE |
Resources
Item | Type |
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No matching documents found. | |
Analytical Test Report:Die Attach | Analytical Test Report |
Analytical Test Report:Die Attach | Analytical Test Report |
Analytical Test Report:Gold Bond Wire | Analytical Test Report |
Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
CTLDM7003-M621.PDF | Device Datasheet |
Material Composition:MCD_TLM621 | Material Composition |
Package Detail Document:TLM621 | Package Detail Document |
Product EOL Notice:TLM621/H Case | Product EOL Notice |
Spice Model:Spice Model CTLDM7003-M621 | Spice Model |
Product Support
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Design Support
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- Online technical data and parametric search
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- Environmental regulation compliance
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- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development