CTLDM7120-M832DS
1A,20V Surface mount MOSFET Dual N-Channel Enhancement Mode
Case Type: TLM832DS
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 10 V
f = 1 MHz
Test Conditions
VDS = 10 V
f = 1 MHz
Test Conditions
VDS = 10 V
f = 1 MHz
Test Conditions
IS = 1 A
Test Conditions
ID = 250 µA
Test Conditions
VDS = 10 V
ID = 500 mA
Test Conditions
VGS = 8 V
Test Conditions
VGS = 8 V
Test Conditions
ID = 1 mA
VDS = 10 V
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 1 A
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 1 A
Test Conditions
VDS = 20 V
Test Conditions
VGS = 4.5 V
ID = 500 mA
(75 mΩ Typical)
Test Conditions
VGS = 2.5 V
ID = 500 mA
(100 mΩ Typical)
Test Conditions
VGS = 1.5 V
ID = 100 mA
(170 mΩ Typical)
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 1 A
Test Conditions
VDD = 10 V
ID = 500 mA
VGS = 5 V
Test Conditions
VDD = 10 V
ID = 500 mA
VGS = 5 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CTLDM7120-M832DS BK | Box@5,000 | Discontinued | 1A,20V Surface mount MOSFET Dual N-Channel Enhancement Mode | EAR99 | 8541.29.0095 | PBFREE | |
| CTLDM7120-M832DS TR | Tape & Reel@3,000 | Discontinued | 1A,20V Surface mount MOSFET Dual N-Channel Enhancement Mode | EAR99 | 8541.29.0095 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| CTLDM7120-M832DS.PDF | Device Datasheet |
| Material Composition:TLM832DS | Material Composition |
| Package Detail Document:TLM832DS | Package Detail Document |
| Product EOL Notice:TLM832DS CASE | Product EOL Notice |
Product Support
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Design Support
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- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
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- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development