CWDM3011N

11A,30V Surface mount MOSFET N-Channel Enhancement Mode High Current

Case Type: SOIC-8

Common Source Input Capacitance (Ciss)
860 pF
Common Source Output Capacitance (Coss)
120 pF
Common Source Reverse Transfer Capacitance (Crss)
100 pF
Continuous Drain Current (ID)
11 A
Diode Forward On Voltage (VSD)
1.2 V
Drain-Source Breakdown Voltage (BVDSS)
30 V
Drain-Source Voltage (VDS)
30 V
Gate Leakage Current, Forward (IGSSF)
100 nA
Gate Leakage Current, Reverse (IGSSR)
100 nA
Gate Threshold Voltage (VGS(th))
1 — 3 V

(1.8 V Typical)

Gate-Drain Charge (Qgd)
2.3 nC
Gate-Source Charge (Qgs)
2 nC
Gate-Source Voltage (VGS)
20 V
Junction Temperature (Tj)
-55 — 150 °C
Maximum Pulsed Drain Current (IDM)
50 A
Power Dissipation (PD)
2.5 W
Saturation Drain Current (IDSS)
1 µA
Static Drain-Source On Resistance (rDS(ON))
20 mΩ

(14 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
30 mΩ

(18 mΩ Typical)

Storage Temperature (Tstg)
-55 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
50 °C/W
Total Gate Charge (Qg)
6.3 nC
Turn Off Time (toff)
43 ns
Turn On Time (ton)
20 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CWDM3011N BK Box@350 Special Order Item 11A,30V Surface mount MOSFET N-Channel Enhancement Mode High Current EAR99 8541.29.0095 PBFREE
CWDM3011N TR13 Tape & Reel@2,500 Special Order Item 11A,30V Surface mount MOSFET N-Channel Enhancement Mode High Current EAR99 8541.29.0095 TIN

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Wire Analytical Test Report
CWDM3011N.PDF Device Datasheet
Material Composition:SOIC-8 Material Composition
Package Detail Document:SOIC-8 Package Detail Document
Process Change Notice:CP375->CP406 Process Change Notice
Process Change Notice:SOIC-8 CASE Process Change Notice
Product Reliability Data:SOIC-8 Package Reliability Product Reliability Data
Spice Model:Spice Model CWDM3011N Spice Model

We provide the highest level of support to insure product is delivered on-time:

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development