CWDM305ND
5.8A,30V Surface mount MOSFET Dual: N-Channel Enhancement Mode High Current
Case Type: SOIC-8
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 10 V
f = 1 MHz
(500 pF Typical)
Test Conditions
VDS = 10 V
f = 1 MHz
(52 pF Typical)
Test Conditions
VDS = 10 V
f = 1 MHz
(50 pF Typical)
Test Conditions
ID = 250 µA
Test Conditions
VDS = 5 V
ID = 5.8 A
Test Conditions
VGS = 20 V
Test Conditions
VGS = 20 V
Test Conditions
ID = 250 µA
Test Conditions
VGS = 5 V
ID = 5.8 A
VDD = 15 V
(1.4 nC Typical)
Test Conditions
VGS = 5 V
ID = 5.8 A
VDD = 15 V
(0.9 nC Typical)
Test Conditions
VDS = 30 V
Test Conditions
VGS = 10 V
ID = 2.9 A
(24 mΩ Typical)
Test Conditions
VGS = 5 V
ID = 2.9 A
Test Conditions
VGS = 5 V
ID = 5.8 A
VDD = 15 V
(4.2 nC Typical)
Test Conditions
VDD = 15 V
ID = 5.8 A
RG = 10 Ω
Test Conditions
VDD = 15 V
RG = 10 Ω
ID = 5.8 A
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CWDM305ND BK | Box@350 | Special Order Item | 5.8A,30V Surface mount MOSFET Dual: N-Channel Enhancement Mode High Current | EAR99 | 8541.29.0095 | PBFREE | |
CWDM305ND TR13 | Tape & Reel@2,500 | Special Order Item | 5.8A,30V Surface mount MOSFET Dual: N-Channel Enhancement Mode High Current | EAR99 | 8541.29.0095 | TIN |
Resources
Item | Type |
---|---|
No matching documents found. | |
Analytical Test Report:Die Attach | Analytical Test Report |
Analytical Test Report:Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Lead frame | Analytical Test Report |
Analytical Test Report:Wire | Analytical Test Report |
CWDM305ND.PDF | Device Datasheet |
Material Composition:SOIC-8 | Material Composition |
Package Detail Document:SOIC-8 | Package Detail Document |
Process Change Notice:CP387X REP. CP376X | Process Change Notice |
Process Change Notice:SOIC-8 CASE | Process Change Notice |
Product Reliability Data:SOIC-8 Package Reliability | Product Reliability Data |
Spice Model:Spice Model CWDM305ND | Spice Model |
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- PbSn plating options
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- Application notes
- Application and design sample kits
- Custom product and package development