CXDM3069N

6.9A,30V Surface mount MOSFET N-Channel Enhancement Mode High Current

Case Type: SOT-89

Common Source Input Capacitance (Ciss)
580 pF
Common Source Output Capacitance (Coss)
42 pF
Common Source Reverse Transfer Capacitance (Crss)
47 pF
Continuous Drain Current (ID)
6.9 A
Drain-Source Breakdown Voltage (BVDSS)
30 V
Drain-Source Voltage (VDS)
30 V
Gate Leakage Current, Forward (IGSSF)
100 nA
Gate Leakage Current, Reverse (IGSSR)
100 nA
Gate Threshold Voltage (VGS(th))
0.7 — 1.4 V

(0.9 V Typical)

Gate-Drain Charge (Qgd)
1.2 nC
Gate-Source Charge (Qgs)
1 nC
Gate-Source Voltage (VGS)
12 V
Junction Temperature (Tj)
-55 — 150 °C
Maximum Pulsed Drain Current (IDM)
40 A
Power Dissipation (PD)
1.2 W
Saturation Drain Current (IDSS)
1 µA
Static Drain-Source On Resistance (rDS(ON))
30 mΩ

(25 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
35 mΩ

(28 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
50 mΩ

(38 mΩ Typical)

Storage Temperature (Tstg)
-55 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
104 °C/W
Total Gate Charge (Qg)
11 nC
Turn Off Time (toff)
28 ns
Turn On Time (ton)
20 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CXDM3069N BK Box@900 Discontinued 6.9A,30V Surface mount MOSFET N-Channel Enhancement Mode High Current EAR99 8541.29.0095 PBFREE
CXDM3069N TR Tape & Reel@1,000 Discontinued 6.9A,30V Surface mount MOSFET N-Channel Enhancement Mode High Current EAR99 8541.29.0095 TIN

Resources

Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CXDM3069N.PDF Device Datasheet
Material Composition:SOT-89 Material Composition
Package Detail Document:SOT-89 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-89 Process Change Notice
Product EOL Notice:CMUD2836 Product EOL Notice
Product Reliability Data:SOT-89 Package Reliability Product Reliability Data
Spice Model:Spice Model CXDM3069N Spice Model

We provide the highest level of support to insure product is delivered on-time:

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development