CXDM6053N
5.3A,60V Surface mount MOSFET N-Channel Enhancement Mode High Current
Case Type: SOT-89
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 30 V
f = 1 MHz
Test Conditions
VDS = 30 V
f = 1 MHz
Test Conditions
VDS = 30 V
f = 1 MHz
Test Conditions
IS = 2 A
Test Conditions
ID = 250 µA
Test Conditions
VGS = 20 V
Test Conditions
VGS = 20 V
Test Conditions
ID = 250 µA
(1.3 V Typical)
Test Conditions
VDS = 30 V
VGS = 5 V
ID = 5.3 A
Test Conditions
VDS = 30 V
VGS = 5 V
ID = 5.3 A
Test Conditions
VDS = 60 V
Test Conditions
VGS = 10 V
ID = 5.3 A
(30 mΩ Typical)
Test Conditions
VGS = 4.5 V
ID = 4.7 A
(33 mΩ Typical)
Test Conditions
VDS = 30 V
VGS = 5 V
ID = 5.3 A
Test Conditions
VDD = 30 V
ID = 4.4 A
RG = 1 Ω
RL = 6.8 Ω
VGS = 4.5 V
Test Conditions
VDD = 30 V
RL = 6.8 Ω
RG = 1 Ω
ID = 4.4 A
VGS = 4.5 V
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CXDM6053N BK | Box@900 | End Of Life | 5.3A,60V Surface mount MOSFET N-Channel Enhancement Mode High Current | EAR99 | 8541.29.0095 | PBFREE | |
CXDM6053N TR | Tape & Reel@1,000 | End Of Life | 5.3A,60V Surface mount MOSFET N-Channel Enhancement Mode High Current | EAR99 | 8541.29.0095 | TIN |
Resources
Item | Type |
---|---|
No matching documents found. | |
Analytical Test Report:Gold Bond Wire | Analytical Test Report |
Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Leadframe | Analytical Test Report |
Analytical Test Report:Sn Plating | Analytical Test Report |
CXDM6053N.PDF | Device Datasheet |
Material Composition:SOT-89 | Material Composition |
Package Detail Document:SOT-89 | Package Detail Document |
Process Change Notice:Copper Wire Bonding - SOT-89 | Process Change Notice |
Process Change Notice:CP372->CP403 | Process Change Notice |
Product EOL Notice:All Devices in the SOT-89 | Product EOL Notice |
Product Reliability Data:SOT-89 Package Reliability | Product Reliability Data |
Spice Model:Spice Model CXDM6053N | Spice Model |
Product Support
Contact Product SupportWe provide the highest level of support to insure product is delivered on-time:
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportWe provide the highest level of support to insure product is delivered on-time:
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- Custom electrical curves
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development