Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 1000 V
f = 1 MHz
Test Conditions
VDS = 1000 V
f = 1 MHz
Test Conditions
VDS = 1000 V
f = 1 MHz
Test Conditions
IS = 5 A
Test Conditions
VDS = 800 V
VGS = 15 V
ID = 20 A
Test Conditions
VGS = 15 V
(30 pA Typical)
Test Conditions
f = 1 MHz
Test Conditions
ID = 17.5 mA
VDS = 15 V
(2.6 V Typical)
Test Conditions
VDS = 800 V
VGS = 15 V
ID = 20 A
Test Conditions
VDS = 1200 V
(50 nA Typical)
Test Conditions
VGS = 15 V
ID = 10 A
(60 mΩ Typical)
Test Conditions
VGS = 15 V
VDS = 800 V
ID = 20 A
Test Conditions
VDS = 10 V
ID = 10 A
Test Conditions
VGS = 15 V
VDS = 800 V
ID = 20 A
Test Conditions
VGS = 15 V
VDS = 800 V
ID = 20 A
Test Conditions
VDS = 800 V
VGS = 15 V
ID = 20 A
Test Conditions
VGS = 15 V
VDS = 800 V
ID = 20 A
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CDMS24760-120 SL | Sleeve@30 | Active | 21A,1200V Through-Hole MOSFET N-Channel SiC | EAR99 | 8541.29.0095 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Molding Compound | Analytical Test Report |
| Analytical Test Report:Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Wire | Analytical Test Report |
| Material Composition:TO-247 | Material Composition |
| Package Detail Document:TO-247 | Package Detail Document |
| Product Brief:SiC MOSFETs | Product Brief |
| Product Reliability Data:TO-247 Package Reliability | Product Reliability Data |
Product Support
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Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
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- Custom electrical curves
- Environmental regulation compliance
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- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development