CDMSJ2204.7-650
4.7A,650V Through-Hole MOSFET N-Channel Super Junction
Case Type: TO-220FP
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IS = 4.5 A
di/dt = 100 A/µs
Test Conditions
IS = 4.5 A
di/dt = 100 A/µs
Test Conditions
VDS = 400 V
f = 250 kHz
Test Conditions
VDS = 400 V
f = 250 kHz
Test Conditions
VDS = 400 V
f = 250 kHz
Test Conditions
IS = 4 A
(0.87 V Typical)
Test Conditions
ID = 250 µA
(730 V Typical)
Test Conditions
f = 250 kHz
VDS = 400 V
Test Conditions
VDD = 325 V
RG = 25 Ω
ID = 4.5 A
VGS = 10 V
Test Conditions
VDS = 20 V
ID = 4.5 A
Test Conditions
VGS = 30 V
Test Conditions
VGS = 30 V
Test Conditions
f = 1 MHz
Test Conditions
ID = 250 µA
VDS = 30 V
(3 V Typical)
Test Conditions
VDS = 520 V
VGS = 10 V
ID = 4.5 A
Test Conditions
VDS = 520 V
VGS = 10 V
ID = 4.5 A
Test Conditions
VDD = 325 V
RG = 25 Ω
ID = 4.5 A
VGS = 10 V
Test Conditions
VDS = 650 V
Test Conditions
VGS = 10 V
ID = 2 A
(861 mΩ Typical)
Test Conditions
VDS = 520 V
VGS = 10 V
ID = 4.5 A
Test Conditions
VDD = 325 V
RG = 25 Ω
VGS = 10 V
ID = 4.5 A
Test Conditions
VDD = 325 V
RG = 25 Ω
VGS = 10 V
ID = 4.5 A
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CDMSJ2204.7-650 SL | Sleeve@50 | Active | 4.7A,650V Through-Hole MOSFET N-Channel Super Junction | EAR99 | 8541.29.0095 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Ni added Al Bond Wire | Analytical Test Report |
| Package Detail Document:TO-220FP | Package Detail Document |
| Product Brief:650V Super Junction Silicon | Product Brief |
| Spice Model:CDMSJ2204.7-650 | Spice Model |