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CMLM0574

Surface mount Module 450mA,30V N-Channel MOSFET&500mA,40V Low VF Schottky Diode

Case Type: SOT-563

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Technical Specifications

Similar Products with Selected Specifications
Common Source Input Capacitance (Ciss)
43 pF
Common Source Output Capacitance (Coss)
8 pF
Common Source Reverse Transfer Capacitance (Crss)
5 pF
Continuous Drain Current (ID)
450 mA
Continuous Forward Current (IF)
500 mA
Diode Forward On Voltage (VSD)
0.5 — 1.1 V
Drain-Source Breakdown Voltage (BVDSS)
30 V
Drain-Source Voltage (VDS)
30 V
Forward Transconductance (gFS)
200 mS
Forward Voltage (VF)
130 mV
Forward Voltage (VF)
210 mV
Forward Voltage (VF)
270 mV
Forward Voltage (VF)
350 mV
Forward Voltage (VF)
470 mV
Gate Leakage Current, Forward (IGSSF)
3 µA
Gate Leakage Current, Reverse (IGSSR)
3 µA
Gate Threshold Voltage (VGS(th))
0.5 — 1 V
Gate-Drain Charge (Qgd)
0.23 nC
Gate-Source Charge (Qgs)
0.15 nC
Gate-Source Voltage (VGS)
8 V
Junction Capacitance (CJ)
50 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
10 A
Peak Repetitive Forward Current (IFRM)
3.5 A
Peak Repetitive Reverse Voltage (VRRM)
40 V
Power Dissipation (PD)
350 mW
Power Dissipation (PD)
300 mW
Power Dissipation (PD)
150 mW
Reverse Breakdown Voltage (BVR)
40 V
Reverse Voltage Leakage Current (IR)
20 µA
Reverse Voltage Leakage Current (IR)
100 µA
Saturation Drain Current (IDSS)
1 µA
Static Drain-Source On Resistance (rDS(ON))
460 mΩ

(280 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
560 mΩ

(390 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
730 mΩ

(550 mΩ Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W
Total Gate Charge (Qg)
0.792 nC

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMLM0574 BK Box@5,000 Active Surface mount Module 450mA,30V N-Channel MOSFET&500mA,40V Low VF Schottky Diode EAR99 8541.50.0080 PBFREE
CMLM0574 TR Tape & Reel@3,000 Active Surface mount Module 450mA,30V N-Channel MOSFET&500mA,40V Low VF Schottky Diode EAR99 8541.50.0080 TIN

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMLM0574.PDF Device Datasheet
Material Composition:SOT-563 Material Composition
Package Detail Document:SOT-563 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-563 Process Change Notice
Process Change Notice:SOT-563 Alternate Lead Frame Process Change Notice
Product Reliability Data:SOT-563 Package Reliability Product Reliability Data
Spice Model:Spice Model CMLM0574_MOSFET Spice Model
Spice Model:Spice Model CMLM0574_SCHOTTKY Spice Model

Product Support

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Design Support

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  • Application and design sample kits
  • Custom product and package development