CMLM0575
Surface mount Module 650mA,20V N-Channel MOSFET&500mA,40V Low VF Schottky Diode
Case Type: SOT-563
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
IS = 200 mA
Test Conditions
ID = 250 µA
Test Conditions
VDS = 10 V
ID = 100 mA
Test Conditions
IF = 100 µA
Test Conditions
IF = 1 mA
Test Conditions
IF = 100 mA
Test Conditions
IF = 500 mA
Test Conditions
IF = 10 mA
Test Conditions
VGS = 4.5 V
Test Conditions
VGS = 4.5 V
Test Conditions
ID = 250 µA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 500 mA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 500 mA
Test Conditions
VR = 1 V
f = 1 MHz
Test Conditions
IR = 500 µA
Test Conditions
VR = 10 V
Test Conditions
VR = 30 V
Test Conditions
VDS = 16 V
Test Conditions
VGS = 4.5 V
ID = 600 mA
(140 mΩ Typical)
Test Conditions
VGS = 2.5 V
ID = 500 mA
(200 mΩ Typical)
Test Conditions
VGS = 1.8 V
ID = 350 mA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 500 mA
Test Conditions
VDD = 10 V
ID = 200 mA
RG = 10 Ω
VGS = 4.5 V
Test Conditions
VDD = 10 V
VGS = 4.5 V
ID = 200 mA
RG = 10 Ω
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMLM0575 TR | Tape & Reel@3,000 | Active | Surface mount Module 650mA,20V N-Channel MOSFET&500mA,40V Low VF Schottky Diode | EAR99 | 8541.50.0080 | TIN |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMLM0575.PDF | Device Datasheet |
| Material Composition:SOT-563 | Material Composition |
| Package Detail Document:SOT-563 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-563 | Process Change Notice |
| Process Change Notice:SOT-563 Alternate Lead Frame | Process Change Notice |
| Product Reliability Data:SOT-563 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMLM0575_DIODE | Spice Model |
| Spice Model:Spice Model CMLM0575_MOSFET | Spice Model |
Product Support
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- Supply management (Customer portals)
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Design Support
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- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development