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CMLM0575

Surface mount Module 650mA,20V N-Channel MOSFET&500mA,40V Low VF Schottky Diode

Case Type: SOT-563

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Technical Specifications

Similar Products with Selected Specifications
Common Source Input Capacitance (Ciss)
100 pF
Common Source Output Capacitance (Coss)
22 pF
Common Source Reverse Transfer Capacitance (Crss)
18 pF
Continuous Drain Current (ID)
650 mA
Continuous Forward Current (IF)
500 mA
Diode Forward On Voltage (VSD)
1.1 V
Drain-Source Breakdown Voltage (BVDSS)
20 V
Drain-Source Voltage (VDS)
20 V
Forward Transconductance (gFS)
200 mS
Forward Voltage (VF)
130 mV
Forward Voltage (VF)
210 mV
Forward Voltage (VF)
350 mV
Forward Voltage (VF)
470 mV
Forward Voltage (VF)
270 mV
Gate Leakage Current, Forward (IGSSF)
1 µA
Gate Leakage Current, Reverse (IGSSR)
1 µA
Gate Threshold Voltage (VGS(th))
0.5 — 1.1 V
Gate-Drain Charge (Qgd)
0.24 nC
Gate-Source Charge (Qgs)
0.17 nC
Gate-Source Voltage (VGS)
8 V
Junction Capacitance (CJ)
50 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
10 A
Peak Repetitive Forward Current (IFRM)
3.5 A
Peak Repetitive Reverse Voltage (VRRM)
40 V
Power Dissipation (PD)
350 mW
Power Dissipation (PD)
300 mW
Power Dissipation (PD)
150 mW
Reverse Breakdown Voltage (BVR)
40 V
Reverse Voltage Leakage Current (IR)
20 µA
Reverse Voltage Leakage Current (IR)
100 µA
Saturation Drain Current (IDSS)
100 nA
Static Drain-Source On Resistance (rDS(ON))
230 mΩ

(140 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
275 mΩ

(200 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
700 mΩ
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W
Total Gate Charge (Qg)
1.58 nC
Turn Off Time (toff)
25 ns
Turn On Time (ton)
10 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMLM0575 TR Tape & Reel@3,000 Discontinued, Stock Only Surface mount Module 650mA,20V N-Channel MOSFET&500mA,40V Low VF Schottky Diode EAR99 8541.50.0080 TIN

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMLM0575.PDF Device Datasheet
Material Composition:SOT-563 Material Composition
Package Detail Document:SOT-563 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-563 Process Change Notice
Process Change Notice:SOT-563 Alternate Lead Frame Process Change Notice
Product Reliability Data:SOT-563 Package Reliability Product Reliability Data
Spice Model:Spice Model CMLM0575_DIODE Spice Model
Spice Model:Spice Model CMLM0575_MOSFET Spice Model

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