CMLM0585

Surface mount Module 650mA,20V P-Channel MOSFET&500mA,40V Low VF Schottky Diode

Case Type: SOT-563

Common Source Input Capacitance (Ciss)
100 pF
Common Source Output Capacitance (Coss)
21 pF
Common Source Reverse Transfer Capacitance (Crss)
25 pF
Continuous Drain Current (ID)
650 mA
Continuous Forward Current (IF)
500 mA
Diode Forward On Voltage (VSD)
1.1 V
Drain-Source Breakdown Voltage (BVDSS)
20 V
Drain-Source Voltage (VDS)
20 V
Forward Transconductance (gFS)
200 mS
Forward Voltage (VF)
130 mV
Forward Voltage (VF)
210 mV
Forward Voltage (VF)
270 mV
Forward Voltage (VF)
350 mV
Forward Voltage (VF)
470 mV
Gate Leakage Current, Forward (IGSSF)
10 µA
Gate Leakage Current, Reverse (IGSSR)
10 µA
Gate Threshold Voltage (VGS(th))
0.5 — 1 V
Gate-Drain Charge (Qgd)
0.36 nC
Gate-Source Charge (Qgs)
0.24 nC
Gate-Source Voltage (VGS)
8 V
Junction Capacitance (CJ)
50 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
10 A
Peak Repetitive Forward Current (IFRM)
3.5 A
Peak Repetitive Reverse Voltage (VRRM)
40 V
Power Dissipation (PD)
350 mW
Power Dissipation (PD)
300 mW
Power Dissipation (PD)
150 mW
Reverse Breakdown Voltage (BVR)
40 V
Reverse Voltage Leakage Current (IR)
20 µA
Reverse Voltage Leakage Current (IR)
100 µA
Saturation Drain Current (IDSS)
100 nA
Static Drain-Source On Resistance (rDS(ON))
360 mΩ

(250 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
500 mΩ

(370 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
800 mΩ
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W
Total Gate Charge (Qg)
1.2 nC
Turn Off Time (toff)
48 ns
Turn On Time (ton)
38 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMLM0585 BK Box@5,000 Active Surface mount Module 650mA,20V P-Channel MOSFET&500mA,40V Low VF Schottky Diode EAR99 8541.50.0080 PBFREE
CMLM0585 TR Tape & Reel@3,000 Active Surface mount Module 650mA,20V P-Channel MOSFET&500mA,40V Low VF Schottky Diode EAR99 8541.50.0080 TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMLM0585.PDF Device Datasheet
Material Composition:SOT-563 Material Composition
Package Detail Document:SOT-563 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-563 Process Change Notice
Process Change Notice:SOT-563 Alternate Lead Frame Process Change Notice
Product Reliability Data:SOT-563 Package Reliability Product Reliability Data
Spice Model:Spice Model CMLM0585_DIODE Spice Model
Spice Model:Spice Model CMLM0585_MOSFET Spice Model

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
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  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development