CMLM0405

Surface mount Module 200mA,40V NPN Low VCE(SAT)&500mA,40V Low VF Schottky Diode

Case Type: SOT-563

Base-Emitter Saturation Voltage (VBE(SAT))
650 — 850 mV

(750 mV Typical)

Base-Emitter Saturation Voltage (VBE(SAT))
950 mV

(850 mV Typical)

Collector-Base Breakdown Voltage (BVCBO)
60 V

(120 V Typical)

Collector-Base Voltage (VCBO)
60 V
Collector-Emitter Breakdown Voltage (BVCEO)
40 V

(60 V Typical)

Collector-Emitter Cutoff Current (ICEV)
50 nA
Collector-Emitter Saturation Voltage (VCE(SAT))
100 mV

(57 mV Typical)

Collector-Emitter Saturation Voltage (VCE(SAT))
200 mV

(90 mV Typical)

Collector-Emitter Voltage (VCEO)
40 V
Continuous Collector Current (IC)
200 mA
Continuous Forward Current (IF)
500 mA
Current Gain-Bandwidth Product (fT)
300 MHz
DC Current Gain (hFE)
90

(180 Typical)

DC Current Gain (hFE)
100

(185 Typical)

DC Current Gain (hFE)
100 — 300

(180 Typical)

DC Current Gain (hFE)
70

(150 Typical)

DC Current Gain (hFE)
30

(90 Typical)

Delay Time (td)
35 ns
Emitter-Base Breakdown Voltage (BVEBO)
6 V

(7.5 V Typical)

Emitter-Base Voltage (VEBO)
6 V
Fall Time (tf)
50 ns
Forward Voltage (VF)
130 mV
Forward Voltage (VF)
210 mV
Forward Voltage (VF)
270 mV
Forward Voltage (VF)
350 mV
Forward Voltage (VF)
470 mV
Input Capacitance (Cib)
8 pF
Input Impedance Common Emitter (hie)
12 kΩ

(1 kΩ Typical)

Junction Capacitance (CJ)
50 pF
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
4 dB
Output Admittance Common Emitter (hoe)
1 — 60 µS
Output Capacitance (Cob)
4 pF
Peak Forward Surge Current (IFSM)
10 A
Peak Repetitive Forward Current (IFRM)
3.5 A
Peak Repetitive Reverse Voltage (VRRM)
40 V
Power Dissipation (PD)
350 mW
Reverse Breakdown Voltage (BVR)
40 V
Reverse Voltage Leakage Current (IR)
30 µA
Reverse Voltage Leakage Current (IR)
100 µA
Rise Time (tr)
35 ns
Small Signal Current Gain (hfe)
100 — 400
Storage Temperature (Tstg)
-65 — 150 °C
Storage Time (ts)
200 ns
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W
Voltage Feedback Ratio Common Emitter (hre)
1 x10-3

(0.01 x10-3 Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMLM0405 BK Box@5,000 Active Surface mount Module 200mA,40V NPN Low VCE(SAT)&500mA,40V Low VF Schottky Diode EAR99 8541.50.0080 PBFREE
CMLM0405 TR Tape & Reel@3,000 Active Surface mount Module 200mA,40V NPN Low VCE(SAT)&500mA,40V Low VF Schottky Diode EAR99 8541.50.0080 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMLM0405.PDF Device Datasheet
Material Composition:SOT-563 Material Composition
Package Detail Document:SOT-563 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-563 Process Change Notice
Process Change Notice:SOT-563 Alternate Lead Frame Process Change Notice
Product Reliability Data:SOT-563 Package Reliability Product Reliability Data

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

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  • Online technical data and parametric search
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  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development