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CMXESD70-4

Surface mount Transient Voltage Suppressor Low Capacitance Array (<=10pF)

Case Type: SOT-26

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Technical Specifications

Similar Products with Selected Specifications
Average Forward Current (IO)
200 mA
Continuous Forward Current (IF)
200 mA
Continuous Reverse Voltage (VR)
70 V
ESD Voltage (VESD)
15 kV
ESD Voltage (VESD)
8 kV
Forward Voltage (VF)
715 mV

(610 mV Typical)

Forward Voltage (VF)
855 mV

(740 mV Typical)

Forward Voltage (VF)
1 V

(0.88 V Typical)

Forward Voltage (VF)
1.25 V

(1.07 V Typical)

Junction Capacitance (CJ)
0.9 pF

(0.45 pF Typical)

Junction Capacitance (CJ)
1 pF

(0.77 pF Typical)

Junction Temperature (Tj)
-55 — 150 °C
Peak Forward Surge Current (IFSM)
2 A
Peak Forward Surge Current (IFSM)
500 mA
Peak Repetitive Forward Current (IFRM)
450 mA
Peak Repetitive Reverse Voltage (VRRM)
70 V
Reverse Breakdown Voltage (BVR)
70 V
Reverse Voltage Leakage Current (IR)
30 nA

(12 nA Typical)

Reverse Voltage Leakage Current (IR)
1 µA

(0.03 µA Typical)

Reverse Voltage Leakage Current (IR)
100 µA

(55 µA Typical)

Storage Temperature (Tstg)
-55 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
556 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMXESD70-4 BK Box@3,500 Active Surface mount Transient Voltage Suppressor Low Capacitance Array (<=10pF) EAR99 8541.10.0070 PBFREE
CMXESD70-4 TR Tape & Reel@3,000 Active Surface mount Transient Voltage Suppressor Low Capacitance Array (<=10pF) EAR99 8541.10.0070 TIN

Resources

Item Type
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
CMXESD70-4.PDF Device Datasheet
Material Composition:SOT-26 Material Composition
Package Detail Document:SOT-26 Package Detail Document
Product Reliability Data:SOT-26 Package Reliability Product Reliability Data
Step File 3D Object:SOT-26 Step File 3D Object

Product Support

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Design Support

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  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development