CTLTVS12

35W,9V Surface mount Transient Voltage Suppressor Low Capacitance (<=10pF)

Case Type: TLM2D3D6

Breakdown Voltage (VBR)
10 — 14 V

(12 V Typical)

Dynamic Resistance (RDYN)
0.71 Ω
Electrical Fast Transient (EFT)
40 A
ESD Voltage (VESD)
30 kV
ESD Voltage (VESD)
30 kV
Forward Voltage (VF)
1 V
Junction Capacitance (CJ)
14 pF
Junction Capacitance (CJ)
5 pF
Junction Temperature (Tj)
-55 — 150 °C
Maximum Clamping Voltage (VC)
18 V
Peak Pulse Power (PPK)
35 W
Reverse Stand-Off Voltage (VRWM)
9 V
Reverse Voltage Leakage Current (IR)
1 µA
Storage Temperature (Tstg)
-55 — 150 °C
Typical Clamping Voltage (VCL)
6 V
Typical Clamping Voltage (VCL)
11 V

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CTLTVS12 TR Tape & Reel@8,000 Discontinued 35W,9V Surface mount Transient Voltage Suppressor Low Capacitance (<=10pF) EAR99 8541.10.0080 TIN

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
CTLTVS12.PDF Device Datasheet
Material Composition:TLM2D3D6 Material Composition
Package Detail Document:TLM2D3D6 Package Detail Document
Product EOL Notice:CTLTVS12 Product EOL Notice
Product Reliability Data:TLM2D3D6 Package Reliability Product Reliability Data

We provide the highest level of support to insure product is delivered on-time:

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development