CTLTVS5V0BULC
30W,5V Surface mount Transient Voltage Suppressor Low Capacitance (<=10pF)
Case Type: TLM2D3D6
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IT = 1 mA
Test Conditions
f = 1 MHz
(0.3 pF Typical)
Test Conditions
IPP = 1 A
(10 V Typical)
Test Conditions
IPP = 2.5 A
(12 V Typical)
Test Conditions
IPP = 4 A
(10 V Typical)
Test Conditions
IPP = 24 A
(22 V Typical)
Test Conditions
VR = 5 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CTLTVS5V0BULC BK | Box@5,000 | Active | 30W,5V Surface mount Transient Voltage Suppressor Low Capacitance (<=10pF) | EAR99 | 8541.10.0080 | PBFREE | |
| CTLTVS5V0BULC TR10K | Tape & Reel@10,000 | Active | 30W,5V Surface mount Transient Voltage Suppressor Low Capacitance (<=10pF) | EAR99 | 8541.10.0080 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| CTLTVS5V0BULC.PDF | Device Datasheet |
| Material Composition:TLM2D3D6 | Material Composition |
| Package Detail Document:TLM2D3D6 | Package Detail Document |
| Product Reliability Data:TLM2D3D6 Package Reliability | Product Reliability Data |
Product Support
Contact Product SupportWe provide the highest level of support to insure product is delivered on-time:
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportWe provide the highest level of support to insure product is delivered on-time:
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- Custom electrical curves
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development