3SMC33A

3000W,33V Surface mount Transient Voltage Suppressor Single: 3000W Uni-Directional

Case Type: SMC

Breakdown Voltage (VBR)
36.7 — 42.2 V
Junction Temperature (Tj)
-65 — 150 °C
Maximum Clamping Voltage (VC)
53.3 V
Peak Forward Surge Current (IFSM)
200 A
Peak Pulse Power (PPK)
3000 W
Reverse Stand-Off Voltage (VRWM)
33 V
Reverse Voltage Leakage Current (IR)
5 µA
Storage Temperature (Tstg)
-65 — 150 °C

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
3SMC33A BK Box@200 Active 3000W,33V Surface mount Transient Voltage Suppressor Single: 3000W Uni-Directional EAR99 8541.10.0080 TIN
3SMC33A TR13 Tape & Reel@3,000 Active 3000W,33V Surface mount Transient Voltage Suppressor Single: 3000W Uni-Directional EAR99 8541.10.0080 TIN

Resources

3SMC5.0A_THRU_3SMC170A_R1.PDF Device Datasheet
Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Plating Analytical Test Report
Analytical Test Report:Solder Analytical Test Report
Material Composition:SMC Material Composition
Package Detail Document:SMC Package Detail Document
Process Change Notice:3KW TVS IN SMC CASE Process Change Notice
Process Change Notice:SMC CASE Process Change Notice
Product Reliability Data:SMC Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development