Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 50 mA
Test Conditions
VS = 40 V
Test Conditions
VS = 40 V
Test Conditions
VS = 10 V
RG = 1 MΩ
Test Conditions
VS = 10 V
RG = 10 kΩ
Test Conditions
VS = 10 V
RG = 1 MΩ
Test Conditions
VS = 10 V
RG = 10 kΩ
Test Conditions
VB = 20 V
CC = 0.2 µF
Test Conditions
VB = 20 V
CC = 0.2 µF
Test Conditions
VS = 10 V
RG = 1 MΩ
Test Conditions
VS = 10 V
RG = 10 kΩ
Test Conditions
VS = 10 V
RG = 200 Ω
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMPP6028 BK | Box@3,500 | Active | 40V,150mA Surface mount Programmable UJT | EAR99 | 8541.30.0080 | PBFREE | |
| CMPP6028 TR | Tape & Reel@3,000 | Active | 40V,150mA Surface mount Programmable UJT | EAR99 | 8541.30.0080 | TIN |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| CMPP6027_SERIES.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMPP6028 | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development