Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
ITM = 1 A
tp = 380 µs
Test Conditions
VD = 6 V
RL = 100 Ω
Test Conditions
VD = 6 V
RL = 100 Ω
Test Conditions
VD = 6 V
RGK = 1 kΩ
Test Conditions
VDRM = 300 V
RGK = 1 kΩ
Test Conditions
VRRM = 300 V
RGK = 1 kΩ
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
2N2328 | Box@500 | Active | 1.6A,300V Through-Hole SCR | EAR99 | 8541.30.0080 | LEAD or TIN |
Resources
Item | Type |
---|---|
No matching documents found. | |
2N2322_SERIES.PDF | Device Datasheet |
Analytical Test Report:Bond Wire | Analytical Test Report |
Analytical Test Report:Cap | Analytical Test Report |
Analytical Test Report:Header | Analytical Test Report |
Analytical Test Report:Header Assembly | Analytical Test Report |
Analytical Test Report:Pure Tin Solder | Analytical Test Report |
Material Composition:TO-39 | Material Composition |
Package Detail Document:TO-39 | Package Detail Document |
Process Change Notice:CS39-4M | Process Change Notice |
Product Reliability Data:TO-39 Package Reliability | Product Reliability Data |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development