C103A

.8A,100V Through-Hole SCR

Case Type: TO-92

Average Gate Power (PG(AV))
10 mW
Forward Voltage (VTM)
1.5 V
Gate Trigger Current (IGT)
200 µA
Gate Trigger Current (IGT)
500 µA
Gate Trigger Voltage (VGT)
0.8 V
Gate Trigger Voltage (VGT)
1 V
Gate Trigger Voltage (VGT)
0.1 V
Holding Current (IH)
5 mA
Holding Current (IH)
10 mA
Junction Temperature (Tj)
-65 — 125 °C
Peak Forward Gate Current (IFGM)
0.5 A
Peak Gate Power (PGM)
1 W
Peak Off-State Blocking Current (IDRM)
1 µA
Peak Off-State Blocking Current (IDRM)
50 µA
Peak One Cycle Surge Current (ITSM)
8 A
Peak Repetitive Off-State Voltage (VDRM)
100 V
Peak Repetitive Reverse Voltage (VRRM)
100 V
Peak Reverse Gate Voltage (VRGM)
8 V
Rate of Rise of Reverse Voltage (dv/dt)
20 V/µs
RMS On-State Current (IT(RMS))
0.8 A
Storage Temperature (Tstg)
-65 — 150 °C
ueak Reverse Blocking Current (IRRM)
1 µA
ueak Reverse Blocking Current (IRRM)
50 µA

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
C103A Box@2,500 Active .8A,100V Through-Hole SCR EAR99 8541.30.0080 LEAD or TIN

Resources

Analytical Test Report:Copper Bonding Wire Analytical Test Report
Analytical Test Report:Copper Wire Analytical Test Report
Analytical Test Report:Epoxy Adhesive Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Free Analytical Test Report
Analytical Test Report:Pure Tin Solder, Sn Analytical Test Report
Analytical Test Report:Tin Plating Analytical Test Report
C103_SERIES.PDF Device Datasheet
Material Composition:TO-92 Material Composition
Package Detail Document:TO-92 Package Detail Document
Process Change Notice:SCR'S FROM TO-92-18R TO TO-92 Process Change Notice
Product Reliability Data:TO-92 Package Reliability Product Reliability Data

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